Wafer stack and method of producing sensors

Details Wafer stack and method of producing sensors Wafer stack and method of producing sensors

1998-01-12

2000-08-22

Acquah, Samuel A.

Etching a substrate: processes

Etching of semiconductor material to produce an article...

216 13, 216 17, 216 39, 257417, 257419, 257684, 257727, H01L 21306

Patent

active

061067350

ABSTRACT:
A wafer stack with sensor elements hermetically sealed in caverns and a method of fabricating the sensors permitting a reduction in the size of the sensors formed after cutting the wafer stack and also yielding considerable savings in chip area in the manufacture of the wafer stack. The wafer stack includes bonding strips arranged between the individual sensor elements. The wafer stack is diced to form individual sensors by sawing in the middle through the bonding strips.

REFERENCES:
patent: 5323051 (1994-06-01), Adams et al.
patent: 5421956 (1995-06-01), Koga et al.
patent: 5528214 (1996-06-01), Koga et al.

Affiliated with

Also associated with

Rating

Wafer stack and method of producing sensors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer stack and method of producing sensors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer stack and method of producing sensors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-576833