Wafer spin chuck and an etcher using the same

Details Wafer spin chuck and an etcher using the same Wafer spin chuck and an etcher using the same

2011-08-30

2011-08-30

MacArthur, Sylvia R. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C134S119000, C134S149000, C134S157000, C134S902000

Reexamination Certificate

active

08007634

ABSTRACT:
A wafer spin chuck and an etcher using the same are provided. According to an aspect of the present invention, there is provide a wafer spin chuck device comprising: a spin body which spins a wafer; and a stationary body which holds the spin body and is under the spin body with a space between the spin body and the stationary body, wherein the stationary body includes a blocking unit which blocks the space with a fluid.

REFERENCES:
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patent: 7288165 (2007-10-01), Polyak et al.
patent: 2004/0065354 (2004-04-01), Ishizaki et al.
patent: 2009/0101285 (2009-04-01), Park et al.
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patent: 61042919 (1986-03-01), None
patent: 01-125936 (1989-05-01), None
patent: 08071878 (1996-03-01), None
patent: 11067650 (1999-03-01), None
patent: 2004-134431 (2004-04-01), None
Office Action from the Japanese Patent Office for the corresponding Japanese patent application No. 2008-113356, issued Aug. 2, 2010.

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