Wafer, semiconductor chip, and semiconductor device

Details Wafer, semiconductor chip, and semiconductor device Wafer, semiconductor chip, and semiconductor device

2005-03-04

2009-11-03

Jackson, Jr., Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257SE23179, C438S462000

Reexamination Certificate

active

07612419

ABSTRACT:
Scribe lines demarcating semiconductor chips comprise, in both the vertical direction and the horizontal direction, first-type scribe lines of the minimum width enabling cutting by dicing or other means, and second-type scribe lines enabling placement of TEGs, alignment marks or other accessories, and a placement pattern is set so that a unit cell which can be exposed in a single shot comprises one second-type scribe line. By this means, the area occupied by scribe lines can be reduced. Further, by decreasing the number of placement of semiconductor chips constituting a unit cell, and by cutting substantially along the center line of second-type scribe lines, the shapes of scribe lines on the periphery of semiconductor chips can be changed, so that the position in the unit cell can be determined.

REFERENCES:
patent: 6713843 (2004-03-01), Fu
patent: 2001/0052789 (2001-12-01), Gerstmeier et al.
patent: 2003/0140514 (2003-07-01), Fu
patent: 2003-258049 (2003-09-01), None

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