Wafer scale thin film package

Details Wafer scale thin film package Wafer scale thin film package

2008-03-25

2008-03-25

Graybill, David E (Department: 2822)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S464000, C438S690000, C438S759000, C438S940000, C438S977000

Reexamination Certificate

active

10438947

ABSTRACT:
A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a compliant medium to relieve stresses caused by thermal expansion mismatch between chip and substrate. Modules comprising chip and thin film may be fabricated at the chip or wafer level. The upper surface of the thin film has an array of pads matching the array of pads on the chip or wafer while the lower surface has pads matching those of the substrate. The multilayer thin film is first formed on a temporary substrate and then the chip is attached to the thin film before release from the temporary substrate. After release, the module is ready for mounting to the second level packaging substrate, such as a chip carrier or PCB. Where the multilayer thin film is formed directly on a wafer, the wafer is then diced to form the module.

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