Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters
Reexamination Certificate
2007-10-16
2007-10-16
Nguyen, Vinh P (Department: 2829)
Electricity: measuring and testing
Impedance, admittance or other quantities representative of...
Lumped type parameters
C324S755090, C324S761010
Reexamination Certificate
active
09254769
ABSTRACT:
A structure useful as a probe for testing electrical interconnections to integrated circuit devices and other electronic components having a substrate with a bond wire elongated electrical conductor extending away from the surface of the substrate. Each of the bond wire elongated electrical conductors has a first end affixed to the surface at an electrical contact location and a multitude of second ends projecting away from the surface. The first end and said second end of bond wire elongated electrical connector has a ball-shaped protuberance positioned thereon and there existsa in the system means for permitting each of the second ends to move about reference positions.The element which contains means for permitting each of the second ends to move about reference positions is a sheet of material having a plurality of through-holes therein through which the second ends project. There is a perforation in each said sheet in the vicinity of said openings.
REFERENCES:
patent: 3795037 (1974-03-01), Luttmer
patent: 5225777 (1993-07-01), Bross
patent: 5371654 (1994-12-01), Beaman et al.
patent: 5810607 (1998-09-01), Shih et al.
patent: 58-165056 (1983-09-01), None
patent: 4-51662 (1992-04-01), None
patent: 4-240570 (1992-08-01), None
patent: 5-55319 (1993-03-01), None
patent: 06082481 (1994-03-01), None
patent: 06204399 (1994-07-01), None
patent: 06300783 (1994-10-01), None
patent: 07301642 (1995-11-01), None
patent: 07321490 (1995-12-01), None
patent: 09061461 (1997-03-01), None
patent: 09229963 (1997-09-01), None
patent: 09281145 (1997-10-01), None
patent: 09304472 (1997-11-01), None
patent: 10019931 (1998-01-01), None
patent: WO95/14314 (1995-05-01), None
patent: WO96/14659 (1996-05-01), None
patent: WO96/14660 (1996-05-01), None
patent: WO96/17378 (1996-06-01), None
Beaman Brian Samuel
Fogel Keith Edward
Lauro Paul Alfred
Shih Da-Yuan
Beck Thomas A.
Morris Daniel P.
Nguyen Vinh P
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