Wafer scale caps located by molding

Details Wafer scale caps located by molding Wafer scale caps located by molding

2005-12-20

2005-12-20

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S398000, C257S704000, C257S710000, C257S924000

Reexamination Certificate

active

06977189

ABSTRACT:
A method is taught for applying and accurately locating a plurality of caps to a plurality of microfabricated devices at the wafer stage. The method involves using a two part mold to make a plurality of first hollow molded caps. The caps are made from a layer of thermoplastic material which is placed in the mold. Each cap having a central portion and a perimeter wall. The mold is opened so that the caps are carried by the first half. The caps are applied to a wafer using the first half. After the caps are applied, the wafer may be separated into individual chips.

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Derwent Abstract Acc No. 2001-150839/16,Cl. L03, JP 2000277753A (Matsushita Electric Works)Oct. 6, 2000.

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