Stone working – Sawing – Rotary
Patent
1998-02-05
2000-08-22
Rose, Robert A.
Stone working
Sawing
Rotary
451450, B28D 104
Patent
active
061055670
ABSTRACT:
A wafer sawing apparatus scribes a wafer having a plurality of ICs which are separated from each other by a plurality of scribe streets so as to cut the wafer into individual ICs. During scribing, silicon particles are produced and heat is generated as the scribing blade abrades the wafer surface. These silicon particles may remain on the surface of the ICs and cause defects in later manufacturing processes. Therefore, the wafer sawing apparatus has two side nozzles, one positioned on each side of the scribing blade to spray a washing solution onto the scribing blade and a top surface of the wafer through an arc having a designated angle, and a center nozzle which is positioned adjacent to and ahead of a cutting edge of the scribing blade in the driving direction, which also sprays the washing solution onto the scribing blade and the top surface of the wafer at a designated downward angle. The wafer sawing apparatus is also equipped with a suction device for suctioning the silicon particles from the top surface of the wafer, at the point where the particles are produced from the wafer by the scribing blade.
REFERENCES:
patent: 4558686 (1985-12-01), Ono
patent: 4569326 (1986-02-01), Tanizaki et al.
patent: 5718615 (1998-02-01), Boucher et al.
Jang Dong Sung
Jang Sam Bok
Sun Yong Kyun
Rose Robert A.
Samsung Electronics Co,. Ltd.
LandOfFree
Wafer sawing apparatus having washing solution spray and suction does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer sawing apparatus having washing solution spray and suction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer sawing apparatus having washing solution spray and suction will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-569445