Wafer protective sheet

Stock material or miscellaneous articles – Structurally defined web or sheet – Nonplanar uniform thickness material

Reexamination Certificate

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Details

C428S066500, C428S179000, C211S041180, C206S710000

Reexamination Certificate

active

07611766

ABSTRACT:
A wafer protective sheet1is made of a synthetic resin sheet with a thickness of 80 to 130 μm having a large number of projected parts and recessed parts on its front and rear surfaces. The large number of projected parts and the large number of recessed parts are respectively disposed so that each part is positioned at intersections of lattice stripes, and the projected part and the recessed part are disposed alternately each other. The sheet has such a water-like cross section that the recessed parts in the rear surface match the projected parts on the front surface and the projected parts on the rear surface match the recessed parts in the front surface. The wafer protective sheet1has a bending resistance of 30 to 80 mm. The wafer protective sheet1of the present invention is sufficiently thin. When the wafer protective sheets are interposed between stacked wafers to protect them, the sheets do not adhere to the wafers. Thus, wafers housed in a container can be protected against vibration during transportation.

REFERENCES:
patent: 3911187 (1975-10-01), Raley
patent: 6286684 (2001-09-01), Brooks et al.
patent: A 9-129719 (1997-05-01), None
patent: A 2003-505875 (2003-02-01), None

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