Fishing – trapping – and vermin destroying
Patent
1988-11-25
1991-12-10
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437946, 134 1, 134 2, 134 3, H01L 21304, H01L 21463
Patent
active
050717766
ABSTRACT:
First, silicon wafers are formed by cutting silicon monocrystalline ingot into slices. Then back side and main surfaces of the wafers are subjected to lapping and etching processes. Next, the wafers are submerged into substantially pure water and ultrasonic waves are applied to the wafer surface via the water to clean at least one of the surfaces of each of the wafers and form gettering damage on the wafer surface. After this, the main surfaces of the wafers which have been subjected to the cleaning and damage-forming process and on which semiconductor elements are to be formed are polished into mirror finish.
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Kubota Atsuko
Matsushita Yoshiaki
Miyashita Moriya
Tsuchiya Norihiko
Wakatsuki Makiko
Chaudhuri Olik
Kabushiki Kaisha Toshiba
Ojan Ourmazd S.
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