Wafer processing machine

Details Wafer processing machine Wafer processing machine

1983-12-22

1985-06-11

Demers, Arthur P.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

118 50, 118724, 204192R, 204192E, 414217, 414222, 414225, 414416, 414417, C23C 1500

Patent

active

045226970

ABSTRACT:
A sputter coating machine (11) includes a rectilinearly translatable load-lock door (16) closing off one end of a vacuumable chamber (12). Wafers (21) to be coated are loaded and unloaded by an elevated blade (24) onto a chuck (57) carried from the inside surface of the door (16). A clamping ring (85) clamps the wafer (21) to the chuck (57) and advances the wafer (21) to the open throat of a gate-valve portion (15) of the chamber (12) into position opposite a magnetron-sputter gun (105) carried from a second door end of the chamber (12). The second door (13) is moveable away from the chamber (12) on guide rails (141) and pivotable about an axis (138) for ease of maintenance.

REFERENCES:
patent: 3856654 (1974-12-01), George
patent: 3921788 (1975-11-01), Roberson et al.
patent: 4311427 (1982-01-01), Coad et al.

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