Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1983-12-22
1985-06-18
Demers, Arthur P.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
118 50, 118724, 204192R, 204192E, 414217, 414222, 414225, 414416, 414417, C23C 1500
Patent
active
045239851
ABSTRACT:
A sputter coating machine includes a rectilinearly translatable load-lock door closing off one end of an evacuable chamber. Wafers to be coated are loaded and unloaded by an elevator blade onto a chuck carried from the inside surface of the door. A clamping ring clamps the wafer to the chuck and advances the wafer through the open throat of a gate-valve portion of the chamber into position opposite a magnetron sputter gun carried from a second door closing off the other end of the chamber. The second door is movable away from the chamber on guide rails and pivotable about an axis for ease of maintenance.
REFERENCES:
patent: 3856654 (1974-12-01), George
patent: 3921788 (1975-11-01), Roberson et al.
patent: 4311427 (1982-01-01), Coad et al.
Aine Harry E.
Demers Arthur P.
Sputtered Films, Inc.
LandOfFree
Wafer processing machine does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer processing machine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer processing machine will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-978942