Wafer processing machine

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Patent

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Details

118 50, 118724, 204192R, 204192E, 414217, 414222, 414225, 414416, 414417, C23C 1500

Patent

active

045239851

ABSTRACT:
A sputter coating machine includes a rectilinearly translatable load-lock door closing off one end of an evacuable chamber. Wafers to be coated are loaded and unloaded by an elevator blade onto a chuck carried from the inside surface of the door. A clamping ring clamps the wafer to the chuck and advances the wafer through the open throat of a gate-valve portion of the chamber into position opposite a magnetron sputter gun carried from a second door closing off the other end of the chamber. The second door is movable away from the chamber on guide rails and pivotable about an axis for ease of maintenance.

REFERENCES:
patent: 3856654 (1974-12-01), George
patent: 3921788 (1975-11-01), Roberson et al.
patent: 4311427 (1982-01-01), Coad et al.

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