Wafer processing including forming trench rows and columns...

Details Wafer processing including forming trench rows and columns... Wafer processing including forming trench rows and columns...

2011-03-01

2011-03-01

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S463000, C438S464000

Reexamination Certificate

active

07897485

ABSTRACT:
Methods for processing semiconductor wafers are described herein. One embodiment includes removing portions of a first side of the semiconductor wafer to form a number of trenches of a particular depth in rows and columns. The method further includes forming a passivation layer on side walls of the number of trenches. The method also includes cutting a second side of the semiconductor wafer in rows and columns aligned with the number of trenches such that the semiconductor wafer singulates into a number of dice.

REFERENCES:
patent: 5340772 (1994-08-01), Rosotker
patent: 5910687 (1999-06-01), Chen et al.
patent: 5925260 (1999-07-01), Jiang
patent: 6017776 (2000-01-01), Jiang et al.
patent: 6074896 (2000-06-01), Dando
patent: 6365958 (2002-04-01), Ibnabdeljalil et al.
patent: 6869861 (2005-03-01), Glenn et al.
patent: 6873024 (2005-03-01), Prabhu et al.
patent: 6890836 (2005-05-01), Howard et al.
patent: 6933212 (2005-08-01), Lee et al.
patent: 6995032 (2006-02-01), Bruhns et al.
patent: 7052977 (2006-05-01), Yegnashankaran et al.
patent: 7109068 (2006-09-01), Akram et al.
patent: 7129114 (2006-10-01), Akram
patent: 7169685 (2007-01-01), Connell et al.
patent: 7179720 (2007-02-01), Mulligan
patent: 7199449 (2007-04-01), Lake
patent: 7259043 (2007-08-01), Rolda, Jr. et al.
patent: 7291543 (2007-11-01), Grigg et al.
patent: 2004/0185580 (2004-09-01), Goh
patent: 2004/0266139 (2004-12-01), Shibata
patent: 2005/0126686 (2005-06-01), Cheong et al.
patent: 2007/0262424 (2007-11-01), Hiatt

Affiliated with

Also associated with

Rating

Wafer processing including forming trench rows and columns... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer processing including forming trench rows and columns..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer processing including forming trench rows and columns... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2741382