Wafer processing including dicing

Details Wafer processing including dicing Wafer processing including dicing

2008-02-04

2009-11-24

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S463000, C438S464000

Reexamination Certificate

active

07622365

ABSTRACT:
Methods for processing semiconductor wafers are described herein. One embodiment includes removing portions of a first side of the semiconductor wafer to form a number of trenches of a particular depth in rows and columns. The method further includes forming a passivation layer on side walls of the number of trenches. The method also includes cutting a second side of the semiconductor wafer in rows and columns aligned with the number of trenches such that the semiconductor wafer singulates into a number of dice.

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