Wafer processing

Details Wafer processing Wafer processing

2011-07-05

2011-07-05

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

Reexamination Certificate

active

07972940

ABSTRACT:
Methods, devices, and systems for wafer processing are described herein. One method of wafer processing includes modifying a peripheral edge of a wafer to create a number of edge surfaces substantially perpendicular to a number of dicing paths and dicing the wafer along the number of dicing paths. In one or more embodiments, the method includes modifying the peripheral edge of the wafer with a first tool and dicing the wafer with a second tool different from the first tool.

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