Wafer polishing apparatus having measurement device and polishin

Details Wafer polishing apparatus having measurement device and polishin Wafer polishing apparatus having measurement device and polishin

1998-07-08

2000-11-21

Scherbel, David A.

Abrading

Machine

Combined

451 41, 451 6, 451287, B24B 100

Patent

active

061495077

ABSTRACT:
A polishing method and apparatus for a semiconductor wafer includes a loading section having a loading platform for mounting a loading cassette, and a loading robot arm for transferring a wafer from the loading cassette. The apparatus includes a standby stage having a pre-polishing stand on which the wafer is placed, and a post-polishing stand for holding the wafer after polishing, and a polishing table on which a polishing process is performed. A wafer moving device transfers the wafer from the pre-polishing stand to the polishing table and back to the post-polishing stand. An unloading section includes an unloading platform for mounting an unloading cassette, and an unloading robot arm for transferring the wafer to the unloading cassette. A measurement device, proximal to the unloading stage, analyzes a polishing state of the wafer and then a cleaning device cleans the wafer after the wafers are analyzed.

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patent: 5904611 (1999-05-01), Takahashi et al.
patent: 6012966 (2000-01-01), Ban et al.

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