Wafer polisher head having floating retainer ring

Details Wafer polisher head having floating retainer ring Wafer polisher head having floating retainer ring

1991-12-20

1993-04-27

Rachuba, M.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51284R, 51237R, 51216LP, 51129, B24B 100

Patent

active

052050823

ABSTRACT:
A polishing head for polishing a semiconductor wafer is described. The head design enables a wafer retainer to float during polishing and yet extend beyond a wafer carrier to define a pocket for the wafer and thereby facilitate wafer changing. The head construction also enables the carrier to be selectively projected beyond the retainer so that the surface of the carrier is easily accessible for changing an insert or the like. The head uses a positive air pressure to press the wafer against the polishing pad and the head includes interfering mechanical constructions which provide the positions mentioned above.

REFERENCES:
patent: 3731435 (1973-05-01), Boettcher et al.
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4519168 (1985-05-01), Cesna
patent: 4918870 (1990-04-01), Torbent et al.
patent: 5081795 (1992-01-01), Tanaka

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