Wafer metrology apparatus and method

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

06919958

ABSTRACT:
This invention is an apparatus for imaging metrology, which in particular embodiments may be integrated with a processor station such that a metrology station is apart from but coupled to a process station. The metrology station is provided with a first imaging camera with a first field of view containing the measurement region. Alternate embodiments include a second imaging camera with a second field of view. Preferred embodiments comprise a broadband ultraviolet light source, although other embodiments may have a visible or near infrared light source of broad or narrow optical bandwidth. Embodiments including a broad bandwidth source typically include a spectrograph, or an imaging spectrograph. Particular embodiments may include curved, reflective optics or a measurement region wetted by a liquid. In a typical embodiment, the metrology station and the measurement region are configured to have 4 degrees of freedom of movement relative to each other.

REFERENCES:
patent: 3827811 (1974-08-01), Kato et al.
patent: 4659220 (1987-04-01), Bronte et al.
patent: 4790664 (1988-12-01), Saito et al.
patent: 5030008 (1991-07-01), Scott et al.
patent: 5125741 (1992-06-01), Okada et al.
patent: 5479252 (1995-12-01), Worster et al.
patent: 5604344 (1997-02-01), Finarov
patent: 5724131 (1998-03-01), Chim et al.
patent: 5747813 (1998-05-01), Norton et al.
patent: 5825498 (1998-10-01), Thakur et al.
patent: 5835225 (1998-11-01), Thakur
patent: 5844684 (1998-12-01), Maris et al.
patent: 5910842 (1999-06-01), Piwonka-Corle et al.
patent: 5963314 (1999-10-01), Worster et al.
patent: 6108091 (2000-08-01), Pecen et al.
patent: 6108092 (2000-08-01), Sandhu
patent: 6142855 (2000-11-01), Nyui et al.
patent: 6215549 (2001-04-01), Suzuki et al.
patent: 6310689 (2001-10-01), Ishikawa et al.
patent: 0 881 484 (1998-02-01), None
patent: 2 314 037 (1997-12-01), None
patent: WO 98/37404 (1998-08-01), None
patent: WO 99/01797 (1999-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wafer metrology apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer metrology apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer metrology apparatus and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3418620

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.