Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2007-09-11
2007-09-11
Goudreau, George A. (Department: 1763)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S455000, C438S459000, C438S464000, C438S928000, C438S968000
Reexamination Certificate
active
10678359
ABSTRACT:
Techniques for transferring a membrane from one wafer to another wafer to form integrated semiconductor devices. In one implementation, a carrier wafer is fabricated to include a membrane on one side of the carrier wafer. The membrane on the carrier wafer is then bond to a surface of a different, device wafer by a plurality of joints. Next, the carrier wafer is etched away by a dry etching chemical to expose the membrane and to leave said membrane on the device wafer. Transfer of membranes with a wet etching process is also described.
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California Institute of Technology
Goudreau George A.
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