Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-07-27
2010-10-05
Monbleau, Davienne (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S723000, C257S778000, C257SE25006, C257SE23085
Reexamination Certificate
active
07808112
ABSTRACT:
Flip chip packages formed at a wafer level on semiconductor wafers for electronic systems provide convenient prepackaging. The package, in one embodiment, includes an adhesive layer applied to an active side of the wafer. The adhesive layer has openings to permit access to the conductive pads on each die. A conductive material substantially fills the openings. A pre-packaged die diced from the semiconductor wafer is mounted to a support wherein the conductive material effects electrical interconnection between the conductive pads on the die and receiving conductors on the support. The pre-packaged die can be coupled to a processor for an electronic system. To provide greater mounting densities, two or more dice may be coupled with the adhesive layer providing a covering for the two or more dice. The prepackaged chip with two or more dice may be coupled to a processor reducing the volume needed in an electronic system.
REFERENCES:
patent: 3040119 (1962-06-01), Granzow
patent: 3320658 (1967-05-01), Bolda et al.
patent: 3396894 (1968-08-01), Ellis
patent: 3472365 (1969-10-01), Tiedema
patent: 3535769 (1970-10-01), Goldschmied
patent: 3719981 (1973-03-01), Steitz
patent: 3744129 (1973-07-01), Dewey, Jr.
patent: 3750265 (1973-08-01), Cushman
patent: 3982320 (1976-09-01), Buchoff et al.
patent: 4099615 (1978-07-01), Lemke et al.
patent: 4142286 (1979-03-01), Knuth et al.
patent: 4209893 (1980-07-01), Dyce et al.
patent: 4216350 (1980-08-01), Reid
patent: 4664309 (1987-05-01), Allen et al.
patent: 4705205 (1987-11-01), Allen et al.
patent: 4712721 (1987-12-01), Noel et al.
patent: 4897708 (1990-01-01), Clements
patent: 4903889 (1990-02-01), Svendsen et al.
patent: 4954875 (1990-09-01), Clements
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5126210 (1992-06-01), Wieserman et al.
patent: 5219117 (1993-06-01), Lin
patent: 5229647 (1993-07-01), Gnadinger
patent: 5347428 (1994-09-01), Carson et al.
patent: 5432999 (1995-07-01), Capps et al.
patent: 5442852 (1995-08-01), Danner
patent: 5468681 (1995-11-01), Pasch
patent: 5477160 (1995-12-01), Love
patent: 5483174 (1996-01-01), Hembree et al.
patent: 5498902 (1996-03-01), Hara
patent: 5523628 (1996-06-01), Williams et al.
patent: 5528080 (1996-06-01), Goldstein
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5675180 (1997-10-01), Pedersen et al.
patent: 5685885 (1997-11-01), Khandros et al.
patent: 5696031 (1997-12-01), Wark
patent: 5713744 (1998-02-01), Laub
patent: 5716222 (1998-02-01), Murphy
patent: 5726493 (1998-03-01), Yamashita et al.
patent: 5736456 (1998-04-01), Akram
patent: 5739585 (1998-04-01), Akram et al.
patent: 5747101 (1998-05-01), Booth et al.
patent: 5789271 (1998-08-01), Akram
patent: 5808360 (1998-09-01), Akram
patent: 5808874 (1998-09-01), Smith
patent: 5811879 (1998-09-01), Akram
patent: 5817540 (1998-10-01), Wark
patent: 5819406 (1998-10-01), Yoshizawa et al.
patent: 5821624 (1998-10-01), Pasch
patent: 5825195 (1998-10-01), Hembree et al.
patent: 5834339 (1998-11-01), Distefano et al.
patent: 5834366 (1998-11-01), Akram
patent: 5844315 (1998-12-01), Melton et al.
patent: 5849608 (1998-12-01), Abe
patent: 5851845 (1998-12-01), Wood et al.
patent: 5851911 (1998-12-01), Farnworth
patent: 5861323 (1999-01-01), Hayes
patent: 5866951 (1999-02-01), Gademann et al.
patent: 5891753 (1999-04-01), Akram
patent: 5897337 (1999-04-01), Kata et al.
patent: 5898224 (1999-04-01), Akram
patent: 5898858 (1999-04-01), Gillespie
patent: 5903058 (1999-05-01), Akram
patent: 5917242 (1999-06-01), Ball
patent: 5929482 (1999-07-01), Kawakami et al.
patent: 5933713 (1999-08-01), Farnworth
patent: 5936305 (1999-08-01), Akram
patent: 5956605 (1999-09-01), Akram et al.
patent: 5973396 (1999-10-01), Farnworth
patent: 5973403 (1999-10-01), Wark
patent: 5982018 (1999-11-01), Wark et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 5994753 (1999-11-01), Nitta
patent: 6001724 (1999-12-01), Stansbury
patent: 6013944 (2000-01-01), Moriya et al.
patent: 6022758 (2000-02-01), Badehi
patent: 6049124 (2000-04-01), Raiser et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6054337 (2000-04-01), Solberg
patent: 6060769 (2000-05-01), Wark
patent: 6063646 (2000-05-01), Okuno et al.
patent: 6071754 (2000-06-01), Wark
patent: 6072236 (2000-06-01), Akram et al.
patent: 6078100 (2000-06-01), Duesman et al.
patent: 6080264 (2000-06-01), Ball
patent: 6081997 (2000-07-01), Chia et al.
patent: 6083820 (2000-07-01), Farnworth
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6103552 (2000-08-01), Lin
patent: 6121689 (2000-09-01), Capote et al.
patent: 6133639 (2000-10-01), Kovac et al.
patent: 6147401 (2000-11-01), Solberg
patent: 6148512 (2000-11-01), Brown
patent: 6153505 (2000-11-01), Bolde et al.
patent: 6159837 (2000-12-01), Yamaji et al.
patent: 6169328 (2001-01-01), Mitchell
patent: 6177296 (2001-01-01), Vindasius et al.
patent: 6181010 (2001-01-01), Nozawa
patent: 6187615 (2001-02-01), Kim et al.
patent: 6190940 (2001-02-01), DeFelice et al.
patent: 6201301 (2001-03-01), Hoang
patent: 6219723 (2001-04-01), Hetherington et al.
patent: 6222259 (2001-04-01), Park et al.
patent: 6222678 (2001-04-01), Kimura et al.
patent: 6228678 (2001-05-01), Gilleo et al.
patent: 6228681 (2001-05-01), Gilleo et al.
patent: 6229209 (2001-05-01), Nakamura et al.
patent: 6239367 (2001-05-01), Hsuan et al.
patent: 6245595 (2001-06-01), Nguyen et al.
patent: 6258627 (2001-07-01), Benenati et al.
patent: 6260264 (2001-07-01), Chen et al.
patent: 6265776 (2001-07-01), Gilleo
patent: 6270363 (2001-08-01), Brofman et al.
patent: 6287893 (2001-09-01), Elenius et al.
patent: 6300673 (2001-10-01), Hoffman et al.
patent: 6303680 (2001-10-01), Neiss
patent: 6306680 (2001-10-01), Fillion et al.
patent: 6313522 (2001-11-01), Akram et al.
patent: 6313528 (2001-11-01), Solberg
patent: 6335571 (2002-01-01), Capote et al.
patent: 6337257 (2002-01-01), Toyosawa
patent: 6348728 (2002-02-01), Aiba et al.
patent: 6350664 (2002-02-01), Haji et al.
patent: 6352881 (2002-03-01), Nguyen et al.
patent: 6376916 (2002-04-01), Hosono et al.
patent: 6399178 (2002-06-01), Chung
patent: 6441487 (2002-08-01), Elenius et al.
patent: 6458622 (2002-10-01), Keser et al.
patent: 6492200 (2002-12-01), Park et al.
patent: 6495916 (2002-12-01), Ohuchi et al.
patent: 6498387 (2002-12-01), Yang
patent: 6528349 (2003-03-01), Patel et al.
patent: 6539624 (2003-04-01), Kung et al.
patent: 6555764 (2003-04-01), Maruyama et al.
patent: 6590279 (2003-07-01), Huang et al.
patent: 6605525 (2003-08-01), Lu et al.
patent: 6613606 (2003-09-01), Lee
patent: 6639303 (2003-10-01), Siniaguine
patent: 6707100 (2004-03-01), Gajda
patent: 6710454 (2004-03-01), Boon
patent: 6734534 (2004-05-01), Vu et al.
patent: 6740964 (2004-05-01), Sasaki
patent: 6812066 (2004-11-01), Taniguchi et al.
patent: 6903451 (2005-06-01), Kim et al.
patent: 6940160 (2005-09-01), Hanaoka et al.
patent: 6982475 (2006-01-01), MacIntyre
patent: 7084513 (2006-08-01), Matsuki et al.
patent: 7646102 (2010-01-01), Boon
patent: 2002/0022301 (2002-02-01), Kwon et al.
patent: 2002/0063311 (2002-05-01), Siniaguine
patent: 2002/0109228 (2002-08-01), Buchwalter et al.
patent: 2002/0167085 (2002-11-01), Ohuchi et al.
patent: 2003/0071352 (2003-04-01), Ohuchi et al.
patent: 2004/0140533 (2004-07-01), Stern
patent: 2004/0154164 (2004-08-01), Kang
patent: 2005/0173809 (2005-08-01), Yamamoto et al.
patent: 2006/0258052 (2006-11-01), Boon
patent: 2006/0261475 (2006-11-01), Boon
patent: 2006/0261493 (2006-11-01), Boon
patent: 2008/0157316 (2008-07-01), Yang
patent: 62174951 (1987-07-01), None
patent: 04-290424 (1992-10-01), None
patent: 09-045726 (1997-02-01), None
patent: 09-219449 (1997-08-01), None
“Shin-Etsu Connectors—AF Type”,Shin-Etsu, http://www.shinetsupolymer.com/aftype.htm,(1997),p. 1.
“Shin-Etsu Connectors—GB- Matrix Type”,Shin-Etsu, http://www.shinetsupolymer.com/gbmtype.htm,(1997),pp. 1-2.
Lau, J. H.,Ball Grid Array Technology, ISBN 0-07-036608-X,(1995),pp. 132, 133, 188-192.
Micro)n Technology, Inc.
Monbleau Davienne
Nguyen Dilinh P
Schwegman Lundberg & Woessner, P.A.
LandOfFree
Wafer level pre-packaged flip chip system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer level pre-packaged flip chip system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer level pre-packaged flip chip system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4210678