Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-07-26
2010-10-12
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257SE23021, C257SE21508, C257SE23032, C257SE25013, C257SE23174, C257S777000, C257S723000, C257S686000, C257S685000, C257S787000, C257S788000, C257S774000, C257S680000, C257S782000, C257S783000
Reexamination Certificate
active
07812447
ABSTRACT:
A pre-packaged flip chip package that includes one or more dice on a semiconductor wafer is disclosed. In the various embodiments, an adhesive layer may be applied to a first side of a finished wafer, having connector pads formed thereon. The adhesive layer may include openings through which the connector pads may be accessed. Conductive elements may be positioned within the adhesive, and configured to electrically couple to the conductive elements.
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Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
Williams Alexander O
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