Wafer-level packaging of electronic devices before singulation

Details Wafer-level packaging of electronic devices before singulation Wafer-level packaging of electronic devices before singulation

2005-03-15

2005-03-15

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

Reexamination Certificate

active

06867060

ABSTRACT:
In one embodiment, the invention provides a method comprising supporting a plurality of active electronic components on a first wafer; shaping a second wafer to define a plurality of spaces, each to accommodate one of the active electronic components when the second wafer is aligned and brought into face-to-face contact with that first wafer in a contact position; moving the second wafer into the contact position; and bonding the second wafer to the first wafer in the contact position.

REFERENCES:
Derwent Abstract 2002-068134. “Fabrication of micro electo mechanical system structure by forming the structure in vacuum area of wafer and pad outside the vacuum area.” Jul. 10, 2002.

Affiliated with

Also associated with

Rating

Wafer-level packaging of electronic devices before singulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer-level packaging of electronic devices before singulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer-level packaging of electronic devices before singulation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3411892