Wafer-level package with silicon gasket

Details Wafer-level package with silicon gasket Wafer-level package with silicon gasket

2005-12-27

2005-12-27

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S456000

Reexamination Certificate

active

06979597

ABSTRACT:
A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of many substances that exhibit acceptable adhesion, sealing, and other properties that ensure a hermetically sealed environment. The gasket is carved out from the cap wafer material itself. The cap wafer is typically made of extremely strong and rigid material such as silicon. Since the gasket is made from the cap wafer, the gasket itself is also extremely strong and rigid.

REFERENCES:
patent: 6228675 (2001-05-01), Ruby et al.
patent: 6265246 (2001-07-01), Ruby et al.
patent: 6285067 (2001-09-01), Hyoudo et al.

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