Wafer level package fabrication method using laser illumination

Details Wafer level package fabrication method using laser illumination Wafer level package fabrication method using laser illumination

2007-07-10

2007-07-10

Heinrich, Samuel M. (Department: 1725)

Electric heating

Metal heating

By arc

C438S127000, C228S120000

Reexamination Certificate

active

10980304

ABSTRACT:
The present invention relates to a WLP fabrication method capable of welding a lid wafer with a device wafer by using laser illumination. The WLP fabrication method can rapidly weld bonding metal strips of device and lid wafers with each other in order to couple the lid wafer with the device wafer while sealing an internal cavity from the outside without giving any thermal effect to a drive unit in the device wafer.

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