Wafer-level package and IC module assembly method for the...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

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Details

C438S114000, C438S108000, C438S465000

Reexamination Certificate

active

11213847

ABSTRACT:
A wafer-level package and an IC module assembly method for a wafer-level package are provided in the present invention. The method comprises forming a metal bump on a wafer, applying a high polymer resin coating to the wafer, grinding a surface of the resin coating, printing an endpoint on the wafer, a grinding and cutting step and bonding the chips to an antenna or substrate with SMT. The present invention can be used to manufacture high quality chips of low cost with mass production to significantly reduce cost and maintain high quality of the products.

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