Wafer-level chip scale packaging for LED comprising carrier...

Details Wafer-level chip scale packaging for LED comprising carrier... Wafer-level chip scale packaging for LED comprising carrier...

2005-11-23

2011-11-01

Gebremariam, Samuel (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S099000, C257SE23101

Reexamination Certificate

active

08049330

ABSTRACT:
A structure of light emitting diode (LED) wafer-level chip scale packaging (WL-CSP) is disclosed. The process of making the same is also provided in this invention. The LED CSP utilizes the through hole metal filling to enhance heat conduction between the LED die and its carrier substrate. The CSP structure is achieved by bonding pre-processed through-hole-filling carrier substrate against the flip-chip LED wafer.

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