Wafer-level-chip-scale package and method of fabrication

Details Wafer-level-chip-scale package and method of fabrication Wafer-level-chip-scale package and method of fabrication

2008-06-16

2009-08-04

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S724000

Reexamination Certificate

active

07569423

ABSTRACT:
A wafer-level-chip-scale package and related method of fabrication are disclosed. The wafer-level-chip-scale package comprises a semiconductor substrate comprising an integrated circuit, a conductive ball disposed on the semiconductor substrate and electrically connected to the integrated circuit, and a protective portion formed from an insulating material and disposed on bottom and side surfaces of the semiconductor substrate.

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