Wafer jig

Supports: racks – Special article – Platelike

Patent

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Details

118500, 206454, A47F 700

Patent

active

052190790

ABSTRACT:
A wafer jig which can relieve a decline in precision of wafer processing is provided. Wafers (30) under processing are placed on supporting plates (6) and, in this condition, set into a heating furnace. This condition allows any possible warp of wafer due to its own weight to be eliminated. Further, particles (dust) contaminating the back side of the wafer (30) do not fall onto a processing surface of another wafer (30) thereunder. Moreover, the wafer (30) is placed in such a way that it is isolated from pillars (4) by a distance (L2) and, for this reason, gas flow disturbance which occurs in the vicinity of pillars does not lower the precision of wafer processing. In addition, a slit (7) which is provided for the supporting plate (6) facilitates wafer conveyance.

REFERENCES:
patent: 3465892 (1969-09-01), Taylor
patent: 3534862 (1970-10-01), Shambelan
patent: 4653650 (1987-03-01), Schulke
patent: 4949848 (1990-08-01), Kos
patent: 5054418 (1991-10-01), Thompson et al.
patent: 5131546 (1992-07-01), Kodera

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