Wafer interposer assembly

Details Wafer interposer assembly Wafer interposer assembly

2005-08-23

2005-08-23

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S673000, C257S701000, C257S734000, C257S778000

Reexamination Certificate

active

06933617

ABSTRACT:
A wafer interposer assembly and a system for building the same are disclosed. The wafer interposer assembly includes a semiconductor wafer (10) having a die (11) and a redistribution layer pad (13) electrically connected to the die (11). An epoxy layer (20) is deposited on the surface of the redistribution layer pad (13) and the die (11). An interposer pad (50) is positioned in an opening (40) in the epoxy layer (20) in electrical contact with the redistribution layer pad (13).

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