Wafer interleaving with electro-optical safety features

Details Wafer interleaving with electro-optical safety features Wafer interleaving with electro-optical safety features

1989-03-06

1991-01-22

Williams, Hezron E.

Communications: electrical

Condition responsive indicating system

Specific condition

340674, 414404, G01B 1104

Patent

active

049874071

ABSTRACT:
A pair of opposed teeth combs hold a first plurality of waters at a first upper location. A lift platform on a machine engageably holds and lifts a second plurality into position to be interleaved into the spaces of the first wafer group. The combs are pivotably mounted such that a skewed water in the group of wafers on one platform comes into contact with a comb and causes the combs to pivot slightly upwardly, or a skewed wafer creates a separation-diminishing force on separated portions of a platform. Moveable suspensions floatably position corners of the separated platform parts relative to each other; and these platform parts react away from an error-initiated contact. Transmitter/receiver units are positioned in optical alignment and a skewed water or a piece of foreign matter causes any one of a plurality of light beams to be broken so that error corrective action is achieved.

REFERENCES:
patent: 4493606 (1985-01-01), Foulke et al.
patent: 4513430 (1985-04-01), Vora et al.
patent: 4568234 (1986-02-01), Lee et al.

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