Wafer holding member

Compositions: ceramic – Ceramic compositions – Refractory

Patent

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Details

C04B 35581

Patent

active

056772530

ABSTRACT:
Disclosure relates to the method for improving the heat absorption characteristic of a wafer holding member made of aluminum nitride during indirect heating and the method for preventing electrostatic adhesion. To establish the former method, the wafer holding member comprises an aluminum nitride based sintered body containing Er.sub.2 O.sub.3 as a sintering aid and silicon in the range of more than 200 ppm to 500 ppm or less and having a thermal conductivity of 150 W/m.k or more, and further comprises a holding base body made of an aluminum nitride based sintered body.

REFERENCES:
patent: 4833108 (1989-05-01), Mizuno et al.
patent: 5077245 (1991-12-01), Miyahara
patent: 5124284 (1992-06-01), Ishida et al.
patent: 5147832 (1992-09-01), Shimoda et al.
patent: 5219803 (1993-06-01), Yamakawa et al.
patent: 5376601 (1994-12-01), Okawa et al.
patent: 5508240 (1996-04-01), Komatsu et al.

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