Wafer holding device

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

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H01G 2300

Patent

active

061081906

ABSTRACT:
A wafer holding device is provided, which comprised a wafer holding stage of ceramics having a internal electrode and a top surface on which at least a wafer is to be mounted, a base block supporting said stage integrated thereto, and a braze material layer to join the stage and the base block therebetween which the layer is interposed, wherein the base block is formed a porous ceramics and a metal filled in pores of the ceramics, the porous ceramics has a thermal expansion coefficient within 3.times.10.sup.-6 /.degree. C. of the difference of the thermal expansion coefficient with respect to the ceramics of the stage, and the braze material layer comprises a aluminum-based braze material.

REFERENCES:
patent: 5078851 (1992-01-01), Nishihata et al.
patent: 5155652 (1992-10-01), Logan et al.
patent: 5191506 (1993-03-01), Logan et al.
patent: 5794838 (1998-08-01), Ushikoshi et al.

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