Wafer heating apparatus and semiconductor manufacturing...

Details Wafer heating apparatus and semiconductor manufacturing... Wafer heating apparatus and semiconductor manufacturing...

2005-06-28

2011-12-06

Robinson, Daniel L (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C118S725000

Reexamination Certificate

active

08071916

ABSTRACT:
A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided.The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.

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