Wafer heating apparatus

Details Wafer heating apparatus Wafer heating apparatus

2005-07-05

2005-07-05

Paik, Sang (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S544000

Reexamination Certificate

active

06914222

ABSTRACT:
To provide a wafer heating apparatus that can measure a surface temperature of a wafer accurately and responsively. A front surface of a ceramic plate2serves as a mounting surface on which a wafer is placed, and a rear surface or an inner portion of the ceramic plate2is formed with a resistance heating element5.A recess9is formed in the rear surface of the ceramic plate2.A temperature measuring member formed of a temperature sensor8aand leads8is inserted in the recess9so as to be held by filling17.In the wafer heating apparatus, a length along the leads from the front of the protective tube to a point where the leads are exposed from the filling is set to 5 to 30 times an outer diameter of the protective tube.

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patent: 2002-100559 (2002-04-01), None

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