Wafer heating and monitor module and method of operation

Details Wafer heating and monitor module and method of operation Wafer heating and monitor module and method of operation

1991-09-03

1992-03-24

Cuchlinski, Jr., William A.

Thermal measuring and testing

Temperature measurement

In spaced noncontact relationship to specimen

374126, 374179, 2504922, G01J 500, G01J 512

Patent

active

050981986

ABSTRACT:
The temperature of a semiconductor wafer during annealing of metallization is accurately and indirectly monitored by supporting the wafer on a thin susceptor of constant emissivity and monitoring the temperature of the susceptor. The system has the added advantage of providing efficient, controlled heating of the wafer by radiant heating of the backside of the susceptor.

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patent: 4435092 (1984-03-01), Iuchi
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patent: 4764026 (1988-08-01), Powell et al.
patent: 4854727 (1989-08-01), Pecot et al.
patent: 4890245 (1989-12-01), Yomoto et al.
patent: 4919542 (1990-04-01), Nulman et al.
patent: 4969748 (1990-11-01), Crowley et al.

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