Wafer heater assembly

Details Wafer heater assembly Wafer heater assembly

1995-11-28

1998-08-18

Berhane, Adolf

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

F27B 514

Patent

active

057960747

ABSTRACT:
A wafer heater assembly (8) for a deposition/etch chamber (2) includes a base (32) and a wafer support or chuck (36), having a wafer-chucking surface (76), spaced apart from the base by a circumferential barrier support (38). A heater sub-assembly (54) is mounted to the wafer support. Bolts (48) are used to secure the wafer support to the base with the barrier support therebetween to press the barrier support against an elastomeric O-ring, a metal V-seal or other fluid seal (46) positioned between the base and base end (42) of the barrier support. This eliminates the need to discard the entire heater assembly if the dielectric wafer-chucking surface becomes damaged. The temperature of the fluid seal is about 50.degree.-70.degree. C. lower than the temperature of the wafer-chucking surface when the wafer-chucking surface is about 200.degree.-300.degree. C.

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P. Singer, "Electrostatis Chucks in Wafer Processing," Semiconductor International, p. 57 (Apr. 1995).

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