Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Combined with the removal of material by nonchemical means
Reissue Patent
2008-03-04
2008-03-04
Pham, Long (Department: 2814)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Combined with the removal of material by nonchemical means
C438S974000
Reissue Patent
active
09704529
ABSTRACT:
A wafer having chamfered bent portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer such as an orientation flatness. The chipping of the wafer can be prevented, and in coating the wafer with a photoresist, forming an epiaxially grown layer on the wafer, etc., films having desired characteristics can be provided on the surface of the wafer.
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Egashira Etuo
Komoriya Susumu
Maejima Hisashi
Nishizuka Hiroshi
Antonelli, Terry Stout & Kraus, LLP.
Pham Long
Renesas Technology Corp.
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