Wafer handler method and system

Details Wafer handler method and system Wafer handler method and system

2007-05-08

2007-05-08

Fox, Charles A. (Department: 3652)

Material or article handling

Process

Of moving material between zones having different pressures...

C414S217000, C414S939000

Reexamination Certificate

active

10687023

ABSTRACT:
Systems and methods for handling wafers include retrieving a first wafer from a wafer cassette using a first arm, transferring the first wafer from the first transfer arm to a second arm, delivering the first wafer for processing to a process chamber using the second arm, removing the first wafer from the process chamber using the first arm, and returning the first wafer to the cassette using the first arm. The systems and methods can include retrieving a first wafer from a wafer cassette using a first arm, delivering the first wafer for processing to a process chamber using the first arm, removing a processed wafer from the process chamber using a second arm, returning the processed wafer to the cassette using the second arm, and iteratively retrieving, delivering, removing and returning wafers from the cassette while alternating arms between iterations.

REFERENCES:
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patent: 4927484 (1990-05-01), Mitomi
patent: 5474410 (1995-12-01), Ozawa et al.
patent: 5486080 (1996-01-01), Sieradzki
patent: 5564889 (1996-10-01), Araki
patent: 6315512 (2001-11-01), Tabrizi et al.
patent: 6368051 (2002-04-01), Raaijmakers
patent: 6481956 (2002-11-01), Hofmeister
patent: 6918731 (2005-07-01), Talmer
patent: 2001/0014267 (2001-08-01), Yamaga et al.
patent: WO 01/78114 (2001-10-01), None

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