Wafer grounding method for electrostatic clamps

Details Wafer grounding method for electrostatic clamps Wafer grounding method for electrostatic clamps

2011-05-31

2011-05-31

Fureman, Jared J (Department: 2836)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

Reexamination Certificate

active

07952851

ABSTRACT:
An electrostatic chuck and method for clamping and de-clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. An arc pin operably coupled to the clamping plate and a power source provides an arc for penetrating an insulating layer of the workpiece. The arc pin is selectively connected to an electrical ground, wherein upon removal of the insulative layer of the workpiece, the arc pin provides an electrical ground connection to the workpiece.

REFERENCES:
patent: 2384707 (1945-09-01), Sweet
patent: 5179498 (1993-01-01), Hongoh et al.
patent: 5625526 (1997-04-01), Watanabe et al.
patent: 5735855 (1998-04-01), Bradley
patent: 5933747 (1999-08-01), Gardner et al.
patent: 6778258 (2004-08-01), del Puerto et al.
patent: 7336471 (2008-02-01), Suehira et al.
patent: 7338494 (2008-03-01), Ryan
patent: 2010/0019462 (2010-01-01), Chen et al.
patent: 2010/0103583 (2010-04-01), Wang et al.
patent: 2010/0110604 (2010-05-01), Smith et al.
patent: 720217 (1996-03-01), None
“Automatic Center Punch”, reprinted from the Internet at http://en.wikpedia.org/wiki/Automatic—center—punch, May 1, 2008, p. 1-2.
Office Action issued Oct. 8, 2010 to U.S. Appl. No. 12/262,990.

Affiliated with

Also associated with

Rating

Wafer grounding method for electrostatic clamps does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer grounding method for electrostatic clamps, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer grounding method for electrostatic clamps will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2687140