Wafer for use in the selective connecting and disconnecting of p

Details Wafer for use in the selective connecting and disconnecting of p Wafer for use in the selective connecting and disconnecting of p

1994-08-15

1996-06-11

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Means joining flexible indefinite length or endless bodies...

156352, 156359, 156499, 156535, 116217, 374160, B29C 3502

Patent

active

055251862

ABSTRACT:
A wafer is used in a device for the selective connecting and disconnecting of plastic tubes. The wafer is in the form of a heated plate having an outwardly extending scoop on each side thereof. The wafer also includes a generally straight line horizontal slit extending through the plate from the trailing downstream edge inwardly. In order to assure single use usage of the wafer, an aperture is provided through the wafer with the aperture being covered by a sensing material. A sensor in the device will inactivate the device if the sensing material is not detected.

REFERENCES:
patent: 3299275 (1967-01-01), Green et al.
patent: 3729360 (1973-04-01), McElroy
patent: 3793119 (1974-02-01), Province
patent: 4516520 (1985-05-01), Whaley

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