Wafer feeding apparatus

Coating apparatus – Gas or vapor deposition – Work support

Patent

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Details

118500, 361234, B05C 1302

Patent

active

047336323

ABSTRACT:
A wafer feeding apparatus comprises a horizontally movable arm section, an electrostatic chuck mechanism having a vertically movable support member attached to the arm section and moving mechanism for moving the support member, and an electrostatic chuck attached to the support member and having two semi-circular electrodes located in a manner to be electrically isolated from each other and each having a wafer attraction section and an insulating film formed on the wafer attraction section. A direct-current voltage is across the electrodes to electrostatically attract a semiconductor wafer to the wafer attraction sections of the electrodes through the insulating film.

REFERENCES:
patent: 4184188 (1980-01-01), Briglia
patent: 4480284 (1984-10-01), Iojo et al.
patent: 4542712 (1985-09-01), Sato et al.

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