Wafer fabrication data acquisition and management systems

Details Wafer fabrication data acquisition and management systems Wafer fabrication data acquisition and management systems

2005-10-04

2005-10-04

Hoff, Marc S. (Department: 2857)

Data processing: measuring, calibrating, or testing

Testing system

Of circuit

C700S121000

Reexamination Certificate

active

06952656

ABSTRACT:
The present invention provides a semiconductor processing device (800) including a tool (802) having one or more sensors, a primary data communication port (804) and a secondary data communication port (806). A sensor data acquisition subsystem (808) acquires sensor data from the tool via the secondary port (806). The data acquisition subsystem (808) acquires MES operation messages via the primary port (804). Sensor data are communicated to a sensor processing unit (828) of a sensor data processing subsystem (810). The sensor processing unit (828) processes and analyzes the sensor data. Additionally, the processing unit (828) can be adapted for making product or processing related decisions, for example activating an alarm if the process is not operating within control limits. In another embodiment, the present invention provides a method and apparatus for processing data from a wafer fab facility (1000) including a plurality of tools (1004–1010) each having a primary data communication port (1012–1018) and a secondary data communication port (1042–1048).

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