Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-12-31
1994-07-12
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
118723R, 134 1, 156345, 427460, H01L 21306, B44C 122, B05D 306, B08B 312
Patent
active
053285565
ABSTRACT:
Method and apparatus are set forth for providing a reactive radical species at a substrate surface. A wall structure defines an interior chamber. A substrate is mounted in the chamber at a target position therein with a surface region of the substrate oriented in a selected direction. A first vaporous chemical is introduced to the chamber with the first vaporous chemical flowing toward the surface region of the substrate. A first radical species is generated from the first vaporous chemical intermediate the position of introduction of the first vaporous chemical and the substrate surface region and at a pressure of no more than about 0.1 Torr without producing significant amounts of ionized species. The first radical species flows toward the surface region of the substrate. The chamber is evacuated and maintained at a pressure of .ltoreq.10.sup.-7 Torr during the introduction of the first vaporous chemical. A second vaporous species may be introduced which reacts with the first radical species to produce a second radical species. Deposition, etching and cleaning can thereby be provided.
REFERENCES:
patent: 4689112 (1987-08-01), Bersin
patent: 4718976 (1988-01-01), Fujimura
patent: 4816098 (1989-03-01), Davis et al.
Nace Technology, Inc.
Powell William A.
LandOfFree
Wafer fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer fabrication will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-393625