Wafer edge polishing system

Details Wafer edge polishing system Wafer edge polishing system

2005-01-11

2005-01-11

Eley, Timothy V. (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S067000

Reexamination Certificate

active

06840841

ABSTRACT:
Disclosed is a wafer edge polishing system which improves the throughput and reduces the average processing cost. The system incorporates a wafer inspection unit. A wafer is polished in a wafer edge polishing unit and carried by a carrier unit to the wafer inspection unit where the polished surfaces of the wafer is inspected, and if it is judged as poorly polished, it is re-carried to the wafer edge polishing unit by the carrier unit.

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