Wafer edge inspection and metrology

Details Wafer edge inspection and metrology Wafer edge inspection and metrology

2011-01-04

2011-01-04

Mehta, Bhavesh M (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C382S199000, C382S232000

Reexamination Certificate

active

07865010

ABSTRACT:
Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.

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Leica Microsystems product brochure entitled “LEICA LDS3300—The Integrated Solution for Automated Macro & Micro Defect Detection, Classification & High Resolution Review,” © Germany 2005; 8 pgs.
PCT Search Report (mailed Sep. 12, 2008); 11 pgs.

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