Wafer edge inspection

Details Wafer edge inspection Wafer edge inspection

2007-01-09

2007-01-09

Rosenberger, Richard A. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

Reexamination Certificate

active

11123913

ABSTRACT:
In one embodiment, a system to inspect the edge of a wafer, comprises an surface analyzer assembly, a first drive assembly to impart linear motion between the surface analyzer and a first surface of the wafer, and a second drive assembly to impart rotary motion between the surface analyzer and the wafer about an axis parallel to the first surface of the wafer.

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