Wafer drying methods of Marangoni type and apparatus...

Details Wafer drying methods of Marangoni type and apparatus... Wafer drying methods of Marangoni type and apparatus...

2005-05-24

2005-05-24

Barr, Michael (Department: 1746)

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

C134S030000, C134S031000, C034S404000, C034S410000

Reexamination Certificate

active

06896743

ABSTRACT:
A wafer drying method includes submerging a wafer in a cleaning solution in a dry chamber. An organic liquid vapor from an organic liquid is supplied into the dry chamber at a first volumetric supply rate to form an organic liquid layer on a surface of the cleaning solution, the organic liquid layer having at least a prescribed concentration of the organic liquid. The organic liquid vapor is supplied into the dry chamber at a second volumetric supply rate that is lower than the first volumetric supply rate. During and/or following the supplying of the organic liquid vapor into the dry chamber, at least a portion of the wafer is removed from the cleaning solution through the organic liquid layer.

REFERENCES:
patent: 5913981 (1999-06-01), Florez
patent: 6095167 (2000-08-01), Florez
patent: 6588437 (2003-07-01), Higashi

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