Wafer drying apparatus

Details Wafer drying apparatus Wafer drying apparatus

2008-03-18

2008-03-18

Barr, Michael (Department: 1792)

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

C134S100100, C134S102100, C134S102200, C134S102300, C134S902000, C034S077000

Reexamination Certificate

active

07343922

ABSTRACT:
A wafer drying method includes submerging a wafer in a cleaning solution in a dry chamber. An organic liquid vapor from an organic liquid is supplied into the dry chamber at a first volumetric supply rate to form an organic liquid layer on a surface of the cleaning solution, the organic liquid layer having at least a prescribed concentration of the organic liquid. The organic liquid vapor is supplied into the dry chamber at a second volumetric supply rate that is lower than the first volumetric supply rate. During and/or following the supplying of the organic liquid vapor into the dry chamber, at least a portion of the wafer is removed from the cleaning solution through the organic liquid layer.

REFERENCES:
patent: 4823819 (1989-04-01), Schmidt
patent: 5571337 (1996-11-01), Mohindra et al.
patent: 5634978 (1997-06-01), Mohindra et al.
patent: 5653045 (1997-08-01), Ferrell
patent: 5884640 (1999-03-01), Fishkin et al.
patent: 5913981 (1999-06-01), Florez
patent: 6095167 (2000-08-01), Florez
patent: 6588437 (2003-07-01), Higashi
Admitted Prior Art: Figure 4.

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