Wafer dividing method

Details Wafer dividing method Wafer dividing method

2005-11-09

2008-12-02

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C257SE21598

Reexamination Certificate

active

07459378

ABSTRACT:
A method of dividing a wafer having a plurality of micro electro mechanical systems and a plurality of streets for partitioning the micro electro mechanical systems formed on the front surface of a wafer substrate, the method comprising a protective tape affixing step for affixing a protective tape to the front surface of the wafer; a cut groove-forming step for forming a cut groove by cutting the wafer having the protective tape affixed thereto along the streets from the back surface of the wafer substrate, leaving a cutting margin having a predetermined thickness on the front surface side of the wafer substrate; and a cutting step for cutting the cutting margins by applying a laser beam to the cutting margins of the cut grooves formed along the streets.

REFERENCES:
patent: 4355457 (1982-10-01), Barlett et al.
patent: 6420206 (2002-07-01), Le et al.
patent: 6498075 (2002-12-01), Fujimoto et al.
patent: 6730579 (2004-05-01), Sasaka
patent: 6734083 (2004-05-01), Kobayashi
patent: 7129114 (2006-10-01), Akram
patent: 2006/0079024 (2006-04-01), Akram
patent: 361095544 (1986-05-01), None
patent: 2001-85365 (2001-03-01), None

Affiliated with

Also associated with

Rating

Wafer dividing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer dividing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer dividing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4046234