Wafer dicing using scribe line etch

Details Wafer dicing using scribe line etch Wafer dicing using scribe line etch

2010-11-24

2011-12-06

Richards, N Drew (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257SE21238

Reexamination Certificate

active

08071429

ABSTRACT:
Embodiments of a method for separating dies from a wafer having first and second sides. The process embodiment includes masking the first side of the wafer, the mask including openings therein to expose parts of the first side substantially aligned with scribe lines of the wafer. The process embodiment also includes etching from the exposed parts of the first side of the wafer until an intermediate position between the first and second sides and sawing the remainder of the wafer, starting from the intermediate position until reaching the second surface.

REFERENCES:
patent: 2007/0184633 (2007-08-01), Yang
patent: 2008/0286938 (2008-11-01), Pu et al.
patent: 2009/0011543 (2009-01-01), Karta et al.
patent: 2009/0191690 (2009-07-01), Boyle et al.
patent: 2009/0289318 (2009-11-01), Lin et al.

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