Wafer dicing/die bonding sheet

Details Wafer dicing/die bonding sheet Wafer dicing/die bonding sheet

2006-12-12

2006-12-12

Feely, Michael J. (Department: 1712)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C428S413000, C428S447000, C428S448000, C428S473500, C525S476000, C525S533000, C525S928000

Reexamination Certificate

active

07147920

ABSTRACT:
In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.

REFERENCES:
patent: 5677393 (1997-10-01), Ohmori et al.
patent: 5728473 (1998-03-01), Inoue et al.
patent: 6268033 (2001-07-01), Oka et al.
patent: 6645632 (2003-11-01), Honda et al.
patent: 6949619 (2005-09-01), Ichiroku et al.
patent: 2001/0031828 (2001-10-01), Honda et al.
patent: 9-67558 (1997-03-01), None
patent: 3221756 (2001-08-01), None

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